JPH0126108Y2 - - Google Patents

Info

Publication number
JPH0126108Y2
JPH0126108Y2 JP1982009293U JP929382U JPH0126108Y2 JP H0126108 Y2 JPH0126108 Y2 JP H0126108Y2 JP 1982009293 U JP1982009293 U JP 1982009293U JP 929382 U JP929382 U JP 929382U JP H0126108 Y2 JPH0126108 Y2 JP H0126108Y2
Authority
JP
Japan
Prior art keywords
die bond
integrated circuit
bond land
chip
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982009293U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58111966U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP929382U priority Critical patent/JPS58111966U/ja
Publication of JPS58111966U publication Critical patent/JPS58111966U/ja
Application granted granted Critical
Publication of JPH0126108Y2 publication Critical patent/JPH0126108Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
JP929382U 1982-01-25 1982-01-25 集積回路部品 Granted JPS58111966U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP929382U JPS58111966U (ja) 1982-01-25 1982-01-25 集積回路部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP929382U JPS58111966U (ja) 1982-01-25 1982-01-25 集積回路部品

Publications (2)

Publication Number Publication Date
JPS58111966U JPS58111966U (ja) 1983-07-30
JPH0126108Y2 true JPH0126108Y2 (en]) 1989-08-04

Family

ID=30021946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP929382U Granted JPS58111966U (ja) 1982-01-25 1982-01-25 集積回路部品

Country Status (1)

Country Link
JP (1) JPS58111966U (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5210678A (en) * 1975-07-15 1977-01-27 Kyocera Corp Ic package
JPS55162252A (en) * 1979-06-05 1980-12-17 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS58111966U (ja) 1983-07-30

Similar Documents

Publication Publication Date Title
JPS594873B2 (ja) 印刷配線板
JPH022842U (en])
JPH0126108Y2 (en])
JPH0617239U (ja) ハイブリッドic用集合基板
JP3259217B2 (ja) ノイズ低減パッケージ
JPH0119395Y2 (en])
JPS6073269U (ja) 電子部品実装構造
JPS5980957A (ja) 半導体装置
JPS59132661U (ja) 混成集積回路用絶縁基板
JPS6334997A (ja) 外部取出し端子パタ−ン
JP2571902Y2 (ja) 電子部品の実装構造
JPH06350025A (ja) 半導体装置
JPS6190203U (en])
JP2533277Y2 (ja) チップキャパシタの接地構造
JPH04303989A (ja) 厚膜回路基板
JPH05326833A (ja) 半導体実装基板
JPS5842961U (ja) セラミツク配線基板
JPS62109332A (ja) 混成集積回路
JPH0382134A (ja) 半導体素子の実装構造
JPS5846473U (ja) 印刷配線パタ−ン
JPS6146769U (ja) 電子回路形成チツプ搭載装置
JPS62264632A (ja) 半導体装置
JP2002110891A (ja) 電子回路ユニット
JPS59113683A (ja) プリント板
JPH0631143U (ja) 印刷配線板